| 1. | Test methods of prepreg for multilayer printed wiring boards
多层印制电路板用半固化片的试验方法 |
| 2. | General rules of prepreg for multilayer printed wiring boards
多层印制电路板用半固化片的通用规则 |
| 3. | Multilayer printed wiring boards
多层印制电路板 |
| 4. | Guidelines for selecting core constructions for multilayer printed wiring boards
多层印制线路板的选择芯结构指南 |
| 5. | Multilayer printed wiring board
刚性印制板 |
| 6. | Printed wiring boards - specification for multilayer printed wiring boards
印制电路板.第6部分:多层印制电路板规定方法 |
| 7. | Prepreg for multilayer printed wiring boards - epoxy resin - impregnated glass cloth
多层印制电路板用半固化片.环氧树脂.浸渍玻璃布 |
| 8. | Prepreg for multilayer printed wiring boards - modified or unmodified polyimide resin - impregnated glass cloth
多层印制电路板的半固化片.改性和未改性浸聚酰亚胺树脂玻璃布 |
| 9. | Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth
多层印制线路板用半固化片. bismaleimide三氮杂苯环氧树脂浸渍玻璃布 |
